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Coverlay 溢膠風險計算器
用膠厚、開窗預留與流動係數估算 adhesive overflow 是否會吃 pad。
Coverlay 溢膠風險計算器怎麼用
Coverlay 溢膠會造成 pad 被膠污染、焊接不良或外觀缺陷。這個工具用膠厚、流動係數、壓合係數、開窗單邊預留與對位公差估算溢膠風險。
Coverlay adhesive overflow can contaminate pads, reduce solderability or create cosmetic defects. This calculator estimates overflow risk from adhesive thickness, flow behavior and opening clearance.
Adhesive overflow risk estimate
公式: Overflow = adhesive thickness x flow factor x pressure factor
Adhesive thickness: nominal adhesive layer thickness. Flow factor: empirical lateral flow multiplier. Pressure factor: lamination pressure and temperature effect. Available margin: opening clearance minus registration tolerance.
公式依據 Formula basis: empirical adhesive-flow risk model using adhesive thickness and process multipliers. Engineering note: flow factor should be calibrated from lamination recipe, coverlay material and inspection data.
範例
0.025 mm adhesive with 2x flow factor and 1.2x pressure factor gives an estimated 0.06 mm overflow.
輸入欄位 Adhesive thickness Flow factor Pressure factor Opening clearance Registration tolerance
結果輸出 Estimated adhesive overflow Available margin Remaining clearance Pass / warning indication
工程注意事項 Adhesive flow depends on coverlay material, lamination recipe, pad density and opening shape. Fine-pitch connector pads need tighter control than large exposed pads. Use cross-section or visual inspection data to tune the flow factor.
驗證檢查 Pad contamination risk Coverlay opening margin Lamination condition Fine-pitch solderability
相關製程站
壓合 / 貼合 - Lamination thickness, adhesive squeeze-out, registration, CTE mismatch 覆蓋膜 / 防焊 - Opening compensation, bridge width, pad exposure, alignment tolerance
FAQ
Why use a flow factor? Adhesive flow is strongly process-dependent. A factor lets you tune the calculator to your factory data later.
Should this be linked with coverlay opening? Yes. Coverlay opening and adhesive overflow are related checks and should be reviewed together for fine-pitch areas.