輸入欄位
- Board thickness
- Finished hole
- Drill allowance
- Pad diameter
- Registration tolerance
FPC / PCB 工程計算機
孔徑縱橫比計算器
計算板厚 / 孔徑、鑽針補償與 annular ring。
孔徑縱橫比計算器怎麼用
孔徑縱橫比用來檢查鑽孔與電鍍能力。板厚越厚、成品孔越小，through-hole plating 的難度越高，也會影響可靠度與良率。
Via aspect ratio checks drilling and copper plating feasibility. A thicker board with a smaller finished hole is more difficult to plate reliably.
Aspect ratio and annular ring
公式: Aspect ratio = board thickness / finished hole diameter
- Board thickness: total board thickness through the plated hole.
- Finished hole: final hole diameter after plating.
- Annular ring: pad radius remaining around the drilled hole.
公式依據
- Formula basis: geometric via aspect ratio and annular-ring calculation.
- Engineering note: drilling, plating and annular-ring acceptance should be checked against manufacturer capability and applicable IPC design rules.
範例
0.8 mm board thickness with 0.2 mm finished hole gives an aspect ratio of 4:1.
結果輸出
- Aspect ratio
- Drill size
- Annular ring
- Effective ring after registration
工程注意事項
- Factory capability varies widely for mechanical drilling, laser drilling and microvia processes.
- Small finished holes need enough pad size to survive registration tolerance.
- High aspect ratio holes require more careful plating process control.
驗證檢查
- Drill capability
- Annular ring DFM
- Through-hole plating
- Hole-to-edge spacing
相關製程站
- 鑽孔 / 雷射孔 - Finished hole, drill compensation, annular ring, hole-to-edge distance
- 電鍍 - Current density, copper thickness, throwing power, plating area loading
相關計算器
- 蝕刻補償計算器 - 用銅厚與 etch factor 估算原稿線寬補償。
- 電鍍時間計算器 - 依面積、電流密度、效率與目標銅厚估算電鍍時間。
- 排版利用率計算器 - 估算 panel 可排片數、旋轉排版與材料利用率。
- Coverlay 開窗計算器 - 依 pad 尺寸、對位公差與溢膠預留估算 coverlay 開窗與橋寬。
FAQ
What aspect ratio is safe?
It depends on factory capability and product class. This page flags conservative risk, but the final limit should come from your manufacturer.
Does this apply to laser vias?
The concept applies, but laser microvias need separate pad, depth and copper filling rules.