輸入欄位
- Plating area
- Current density
- Target copper thickness
- Current efficiency
FPC / PCB 工程計算機
電鍍時間計算器
依面積、電流密度、效率與目標銅厚估算電鍍時間。
電鍍時間計算器怎麼用
電鍍時間估算可用來檢查電流密度、電鍍面積、目標銅厚與 amp-hour loading。實際量產仍需考慮孔內 throwing power、掛架、遮蔽與藥水狀態。
Copper plating time estimates help review current density, plating area, target copper thickness and amp-hour loading. Production plating also depends on bath condition and throwing power.
Copper deposition estimate
公式: Time (min) = target copper (um) / (0.329 x current density x efficiency)
- Target copper: copper thickness to be deposited.
- Current density: amperes per square decimeter.
- Efficiency: plating current efficiency.
公式依據
- Formula basis: Faraday's law of electrolysis adapted for copper deposition thickness.
- Engineering note: bath efficiency, throwing power and hole-wall copper thickness must be validated by production measurement.
範例
At 2 A/dm2 and 90% efficiency, depositing 20 um copper takes about 33.8 minutes.
結果輸出
- Estimated plating time
- Total current
- Amp-hour loading
工程注意事項
- Through-hole copper thickness may lag surface copper depending on throwing power.
- Very high current density can create roughness, burning or poor distribution.
- For production control, use real bath efficiency and measured copper thickness data.
驗證檢查
- Current density window
- Plating thickness
- Amp-hour loading
- Hole copper reliability
相關製程站
- 電鍍 - Current density, copper thickness, throwing power, plating area loading
相關計算器
- 孔徑縱橫比計算器 - 計算板厚 / 孔徑、鑽針補償與 annular ring。
- 蝕刻補償計算器 - 用銅厚與 etch factor 估算原稿線寬補償。
- 排版利用率計算器 - 估算 panel 可排片數、旋轉排版與材料利用率。
- Coverlay 開窗計算器 - 依 pad 尺寸、對位公差與溢膠預留估算 coverlay 開窗與橋寬。
FAQ
Why is the result only an estimate?
It assumes a simplified copper deposition rate. Real plating depends on bath chemistry, agitation, panel geometry and current distribution.
Should I use panel area or copper exposed area?
Use the area that receives plating current for the process being estimated. The factory method should define the area basis.