輸入欄位
- Finished trace width
- Copper thickness
- Etch factor
- Process bias
FPC / PCB 工程計算機
蝕刻補償計算器
用銅厚與 etch factor 估算原稿線寬補償。
蝕刻補償計算器怎麼用
蝕刻補償用來把目標成品線寬轉成 artwork 線寬。銅厚越厚、etch factor 越差，側蝕量越大，線寬補償也要越明確。
Etching compensation converts a target finished trace width into an artwork width. Thicker copper and lower etch factor increase side etch.
Artwork width estimate
公式: Artwork width = finished width + 2 x side etch + process bias
- Finished width: target trace width after etching.
- Side etch: lateral copper loss per side.
- Process bias: extra compensation based on factory experience.
公式依據
- Formula basis: etch-factor geometry using copper thickness and lateral side etch.
- Engineering note: production artwork compensation should be tuned from measured factory etching data.
範例
For 0.10 mm finished trace, 35 um copper and etch factor 3, side etch is about 11.7 um per side.
結果輸出
- Recommended artwork width
- Estimated side etch per side
工程注意事項
- Etch factor depends on equipment, chemistry, copper thickness and pattern density.
- Fine-line FPC requires close alignment between design rules and real etching capability.
- Use production measurement feedback to replace the generic process bias.
驗證檢查
- Minimum finished trace width
- Copper thickness selection
- Artwork compensation
- Copper balance
相關製程站
- 蝕刻 - Etch factor, undercut, finished width, copper balance
相關計算器
- 孔徑縱橫比計算器 - 計算板厚 / 孔徑、鑽針補償與 annular ring。
- 電鍍時間計算器 - 依面積、電流密度、效率與目標銅厚估算電鍍時間。
- 排版利用率計算器 - 估算 panel 可排片數、旋轉排版與材料利用率。
- Coverlay 開窗計算器 - 依 pad 尺寸、對位公差與溢膠預留估算 coverlay 開窗與橋寬。
FAQ
Is etch factor fixed?
No. It changes with process chemistry, conveyor speed, copper thickness, pattern density and equipment condition.
Why include process bias?
Factories often apply empirical compensation from historical measurement data. This is where your own formula can become much stronger.