Stack-up thickness and feature drawing are used for quotation, material selection, bend radius review, connector fit and reliability planning. This tool builds a layer-by-layer estimate with draggable assembly features for coverlay openings, air gaps, through holes, buried vias and flippable blind vias, then copies a clean stack-up diagram for PPT or engineering reports.
Zone layer sum
公式: Zone thickness = included material thickness + air-gap thickness
Layer thickness: nominal material thickness in mm.
Included layer: material counted in the current local zone.
Air gap: spacing retained in the geometry, but not counted as material.
Removed / reference layer: excluded from the local thickness calculation.
Assembly feature span: selected start and stop layers used to draw local features such as through, buried and blind vias.
公式依據
Formula basis: arithmetic stack-up thickness summation from nominal material thickness values.
Engineering note: lamination compression, adhesive flow and local openings should be confirmed with factory stack-up data.
範例
A 2-layer FPC can show a coverlay opening over the top layer, an air gap over the PI core, a blind via from the surface to L1, a buried via between copper layers, or a through hole across the full stack-up.
輸入欄位
Calculation zone
Layer name
Layer material type
Zone state
Layer thickness
Layer enabled state
Assembly feature type
Feature X position
Feature width
Feature start layer
Feature stop layer
Feature drag, resize, duplicate and flip controls
結果輸出
Zone stack-up thickness
Material thickness
Air-gap thickness
Feature span thickness
Thickness in mil
Quick bend radius reference
Editable stack-up feature drawing
Copyable PNG diagram for PPT
工程注意事項
Adhesive and coverlay thickness may change after lamination.
For connector areas, include stiffener and bonding adhesive in the local thickness.
For coverlay openings, removed layers are shown for review but excluded from the zone total.
For air-gap bend areas, the gap keeps geometric spacing while contributing no material thickness.
Dragging an assembly feature changes its board position while preserving the selected layer span.
Ctrl-drag duplicates an assembly feature, and double-clicking a blind via flips its stack-up direction.
The copy-image action exports a clean diagram without selection handles, making it suitable for PowerPoint, RFQ notes and process review documents.
驗證檢查
Zone thickness tolerance
Coverlay opening review
Air-gap bend-zone review
Through-hole span review
Buried-via span review
Blind-via direction review
Connector thickness match
Lamination review
PPT diagram communication
相關製程站
疊構設計 - Total thickness, dielectric spacing, symmetry, controlled impedance