Inputs
- Plating area
- Current density
- Target copper thickness
- Current efficiency
FPC / PCB Engineering Calculator
Copper Plating Time Calculator
Estimate copper plating current, time and amp-hour loading.
How to use the Copper Plating Time Calculator
Copper plating time estimates help review current density, plating area, target copper thickness and amp-hour loading. Production plating also depends on bath condition and throwing power.
Copper deposition estimate
Formula: Time (min) = target copper (um) / (0.329 x current density x efficiency)
- Target copper: copper thickness to be deposited.
- Current density: amperes per square decimeter.
- Efficiency: plating current efficiency.
Formula Basis
- Formula basis: Faraday's law of electrolysis adapted for copper deposition thickness.
- Engineering note: bath efficiency, throwing power and hole-wall copper thickness must be validated by production measurement.
Example
At 2 A/dm2 and 90% efficiency, depositing 20 um copper takes about 33.8 minutes.
Outputs
- Estimated plating time
- Total current
- Amp-hour loading
Engineering Notes
- Through-hole copper thickness may lag surface copper depending on throwing power.
- Very high current density can create roughness, burning or poor distribution.
- For production control, use real bath efficiency and measured copper thickness data.
Validation Checks
- Current density window
- Plating thickness
- Amp-hour loading
- Hole copper reliability
Related Manufacturing Process
- Copper Plating - Current density, copper thickness, throwing power, plating area loading
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FAQ
Why is the result only an estimate?
It assumes a simplified copper deposition rate. Real plating depends on bath chemistry, agitation, panel geometry and current distribution.
Should I use panel area or copper exposed area?
Use the area that receives plating current for the process being estimated. The factory method should define the area basis.